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All Things Microsoft => Microsoft Hardware => Topic started by: rtgwbmsr on 25 November 2002, 05:09

Title: Intel heatsinks bending boards
Post by: rtgwbmsr on 25 November 2002, 05:09
Check this out:

(http://www.akgames.net:8000/Downloads/Files/Personal/bend.jpg)

That can't be good for the board! It has to have some effect on the longetivity of the thing. Yet Intel insists it's fine.
Title: Intel heatsinks bending boards
Post by: RudeCat7 on 25 November 2002, 05:53
I'm sure Intel would.  :rolleyes:
Title: Intel heatsinks bending boards
Post by: pkd_lives on 26 November 2002, 02:18
Where is that from, is it your board? That is not good. If there are ANY traces or components under the board it is not acceptable.

It certainly looks heat damaged, and if it is then it is a long term threat. The board is conducting heat and this process will continue.

As FR4 contiunes to conduct heat a limit is reached, where it cannot conduct any more heat, and this will cause the warping. The warped area will see a decline in it's abiltity to disipate heat (which is good but not that good in the first place) This also alters the environmental characteristics of the board. You can no longer guarantee any environmental spec on the board (heat, vibration, cooling, etc.). It is potentially possible that traces and components will be damaged as a result of the spreading. If that much heat is failing to be dissipated from the board then nearby components will also be suffering. The trouble is that it might take a few years, and in that case the board will be obsolete before it actually causes damage, and therefore no support is necessary.

It is bad design. However it depends on who placed the heatsink, and whether or not the enclosure met the specs. Not enough information to state who is responsible. But it is not acceptable - whoever claimed that does not know what they are talking about, or they based their decision on the fact that the board will be obsolete before more serious damage can occur.
Title: Intel heatsinks bending boards
Post by: rtgwbmsr on 26 November 2002, 02:45
Where I got it from was an Intel tech doc.
Get it here:
http://developer.intel.com/design/pentium4/guides/298590.htm (http://developer.intel.com/design/pentium4/guides/298590.htm)

It's on page 9 of that PDF file. On that page there is that picture and this text:

 
quote:
 The boxed Intel
Title: Intel heatsinks bending boards
Post by: pkd_lives on 26 November 2002, 03:04
Nasty.

Classic cop out. The owness is on the motherboard designer, and quite correct that it is materials dependant.

It may be normal to see warping but it is not right. This is a design flaw which demonstrates that x86 is nearing its life span - unless they start on a ridical physical design change. Unfortunately things like this are going to become more and more common. until they totally redesign the processor from a physical standpoint.
Title: Intel heatsinks bending boards
Post by: Kintaro on 26 November 2002, 11:10
Since when did Microsoft own intel

Move the thread someone.
Title: Intel heatsinks bending boards
Post by: rtgwbmsr on 28 November 2002, 07:58
quote:
Originally posted by X11 / BOB: l33t h4x0r:
Since when did Microsoft own intel

Move the thread someone.


M$ has owned Intel for a while. They made a certain something called "Wintel".

Besides, what other hardware forum did you plan to move this to? Oh, that's right there aren't any.  :rolleyes:
Title: Intel heatsinks bending boards
Post by: Refalm on 28 November 2002, 20:15
quote:
X11 / BOB: l33t h4x0r: Move the thread someone.


You'd better say: "Move the thread, Refalm.". Webmaster has joined a sekt and Aaron smashed his computer after a rage from what I can tell  (http://tongue.gif)
Title: Intel heatsinks bending boards
Post by: KernelPanic on 28 November 2002, 20:18
Where else could this go?
Title: Intel heatsinks bending boards
Post by: Master of Reality on 28 November 2002, 20:52
the lounge...
Title: Intel heatsinks bending boards
Post by: lazygamer on 29 November 2002, 06:09
Holy shit! Ummm that is a motherboard, not a CPU right? If so, then WTF?! Christ, how do you fit a heatsink so big in a case?

BTW, isn't it true that heatsinks+fans only work effectively up to a certain temperature because you eventually end up blowing around hot air? Although I remember reading that you need to have a setup that takes the hot air out of the case, so I guess merely having air blowing is not enough for hot chips.
Title: Intel heatsinks bending boards
Post by: Fett101 on 29 November 2002, 21:06
quote:
Originally posted by lazygamer:
Holy shit! Ummm that is a motherboard, not a CPU right? If so, then WTF?! Christ, how do you fit a heatsink so big in a case?

BTW, isn't it true that heatsinks+fans only work effectively up to a certain temperature because you eventually end up blowing around hot air? Although I remember reading that you need to have a setup that takes the hot air out of the case, so I guess merely having air blowing is not enough for hot chips.


Yeah. Air should be pulled from the front of the case, and exit out the upper back in a timely and single file manner.
Title: Intel heatsinks bending boards
Post by: choasforages on 29 November 2002, 21:39
or a similar setup to my car should be used

liquid coolent move from a plastic tube onto the waterblock and out to the big radiater with 3 or 4 120mm fans attached to it, driven by some sort of pump.


/*if you didn't catch the supposed sarcism,i hope its in there, im descrebing water cooling*/